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  • Sandy Lin added new article
    2023-04-13 02:50:53 -
    Brief Introduction of Common MCU Packages
    Microcontroller Unit (MCU) packages are the physical containers that house the integrated circuits (ICs) that make up a microcontroller. Here are some of the most common MCU packages: Dual In-line Package (DIP): DIP is one of the oldest and most widely used MCU packages. It is a rectangular plastic package with two rows of pins along its length. Small Outline Integrated Circuit (SOIC): SOIC...
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  • Christian Johnson added new article
    2023-10-18 08:36:13 -
    Electronic Grade Isopropyl Alcohol Market Overview, Merger and Acquisitions, Drivers, Restraints, and Industry Forecast
    Electronic Grade Isopropyl Alcohol (IPA) is a high-purity solvent widely used in the electronics industry for various applications, including cleaning electronic components, removing flux residues, and as a carrier solvent in the formulation of electronic materials. Its exceptional purity and low impurity content make it a crucial chemical in the manufacturing of microelectronic devices,...
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  • Christian Johnson added new article
    2023-10-05 09:48:38 -
    Electronic Grade Isopropyl Alcohol Market Overview, Merger and Acquisitions, Drivers, Restraints, and Industry Forecast
    Electronic Grade Isopropyl Alcohol (IPA) is a high-purity solvent widely used in the electronics industry for various applications, including cleaning electronic components, removing flux residues, and as a carrier solvent in the formulation of electronic materials. Its exceptional purity and low impurity content make it a crucial chemical in the manufacturing of microelectronic devices,...
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  • Christian Johnson added new article
    2023-10-11 14:19:26 -
    Graphene Market Overview, Merger and Acquisitions, Drivers, Restraints, and Industry Forecast
    The graphene market has experienced substantial growth and is revolutionizing various industries due to its exceptional properties and potential applications. Graphene, a single layer of carbon atoms arranged in a two-dimensional honeycomb lattice, possesses remarkable mechanical, electrical, and thermal characteristics, making it one of the most promising materials for advanced...
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  • Sandy Lin added new article
    2023-04-18 09:03:56 -
    The Differences Single-packaged and Co-packaged ICs
    The co-packaging is a packaging technology that connects multiple chips together through leads to form a larger IC structure, allowing for better integration and reduced chip size. The advantages of co-packaged IC are improved integration and performance, as well as reduced chip size, which increases functional density and speed. Compared to single packaging technology,...
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  • Sandy Lin added new article
    2023-04-12 03:04:52 -
    YFM Joins Hands with Shenzhen Metro for MCU Promotion
    In April 2023, Shenzhen Yufan Microelectronics started full-scale advertising in Shenzhen's metro system to continuously promote the YF brand and its new product line-the co-packaged multifunctional MCUs! Established in 2017, Yufan Microelectronics is a company specializing in MCU trading, custom chip packaging and chip burning, with a complete MCU supply...
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