Microcontroller Unit (MCU) packages are the physical containers that house the integrated circuits (ICs) that make up a microcontroller. Here are some of the most common MCU packages: Dual In-line Package (DIP): DIP is one of the oldest and most widely used MCU packages. It is a rectangular plastic package with two rows of pins along its length. Small Outline Integrated Circuit (SOIC): SOIC...

Step-up converter IC, also known as a DC-DC boost converter or boost module, is an integrated circuit that is designed to increase the voltage level of an input power source. The chips are widely utilized in electronic devices such as smartphones, tablets, laptops, cameras, televisions, and other electronic devices.   The working principle of a step-up converter IC is based on the...

The co-packaging is a packaging technology that connects multiple chips together through leads to form a larger IC structure, allowing for better integration and reduced chip size. The advantages of co-packaged IC are improved integration and performance, as well as reduced chip size, which increases functional density and speed. Compared to single packaging technology,...

In April 2023, Shenzhen Yufan Microelectronics started full-scale advertising in Shenzhen's metro system to continuously promote the YF brand and its new product line-the co-packaged multifunctional MCUs! Established in 2017, Yufan Microelectronics is a company specializing in MCU trading, custom chip packaging and chip burning, with a complete MCU supply...